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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
Rev. 05 -- 13 June 2005 Product data sheet
1. General description
The TDA3663 is a fixed 3.3 V voltage regulator with a very low dropout voltage and quiescent current, which operates over a wide supply voltage range.
2. Features
s s s s s s Fixed 3.3 V, 100 mA regulator Supply voltage range up to 45 V Very low quiescent current of 15 A (typical value) Very low dropout voltage High ripple rejection Protections: x Reverse polarity safe (down to -25 V without high reverse current) x Negative transient of 50 V (RS = 10 , t < 100 ms) x Able to withstand voltages up to 18 V at the output (supply line may be short-circuited) x ESD protection on all pins x DC short-circuit safe to ground and VP of the regulator output x Temperature protection (at Tj > 150 C)
3. Quick reference data
Table 1: Quick reference data Tamb = 25 C; unless otherwise specified. Symbol Supply VP Iq supply voltage regulator operating
[1]
Parameter
Conditions
Min 3 -
Typ 14.4 15
Max 45 30
Unit V A
quiescent supply VP = 14.4 V; IREG = 0 mA current output voltage 8 V VP 22 V; IREG = 0.5 mA 6 V VP 45 V; IREG = 0.5 mA; 0.5 mA IREG 100 mA
Voltage regulator VREG 3.16 3.13 3.13 3.3 3.3 3.3 0.18 3.44 3.47 3.47 0.3 V V V V
VREG(drop) dropout voltage
[1]
VP = 3.1 V; IREG = 50 mA; Tamb 85 C
The regulator output will follow VP if VP < VREG + VREG(drop).
Philips Semiconductors
TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
4. Ordering information
Table 2: Ordering information Package Name TDA3663 TDA3663AT SO4 SO8 Description plastic small outline package; 4 leads; body width 3.5 mm plastic small outline package; 8 leads; body width 3.9 mm Version SOT223-1 SOT96-1 Type number
5. Block diagram
VP
1 (8) REGULATOR BAND GAP THERMAL PROTECTION 3 (1) REG
TDA3663 (TDA3663AT)
2, 4 (2, 3, 6, 7)
mgs584
GND
Pin numbers in parenthesis refer to TDA3663AT.
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
VP GND
1
REG GND
1 2
8 7
VP GND GND n.c.
2
TDA3663 4 GND
GND 3 4 n.c.
001aac941
TDA3663AT
6 5
001aac942
REG
3
Fig 2. Pin configuration for SO4
Fig 3. Pin configuration for SO8
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Product data sheet
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
6.2 Pin description
Table 3: Symbol VP GND REG n.c.
[1]
Pin description Pin SO4 1 2 and 4 3 SO8 8 2, 3, 6 and 8 1 4 and 5 supply voltage ground [1] regulator output not connected Description
For he SO8 package all GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance Rth(j-a) by soldering these pins to a ground plane. The ground plane on the top side of the PCB acts like a heat spreader.
7. Functional description
The TDA3663 is a fixed 3.3 V regulator which can deliver output currents up to 100 mA. The regulator is available in SO8 and SO4 packages. The regulator is intended for portable, mains and telephone applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions. The device remains operational down to very low supply voltages and below this voltage it switches off. A temperature protection circuit is included which switches off the regulator output at a junction temperature above 150 C.
8. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VP VP(rp) Ptot Parameter supply voltage reverse polarity supply voltage total power dissipation TDA3663 TDA3663AT Tstg Tamb Tj storage temperature ambient temperature junction temperature temperature of copper area is 25 C Tamb = 25 C non-operating operating operating -55 -40 -40 4.1 5 +150 +125 +150 W W C C C non-operating Conditions Min Max 45 -25 Unit V V
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
9. Thermal characteristics
Table 5: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient SO4 SO8 Rth(j-c) thermal resistance from junction to case SO4 SO8 to center pins; soldered to center pins; soldered 25 30 K/W K/W in free air; soldered in free air; soldered 100 155 K/W K/W Conditions Typ Unit
10. Characteristics
Table 6: Characteristics VP = 14.4 V; Tamb = 25 C; measured with test circuit of Figure 15; unless otherwise specified. Symbol VP Iq Parameter supply voltage quiescent supply current Conditions regulator operating VP = 4.5 V; IREG = 0 mA VP = 14.4 V; IREG = 0 mA 6 V VP 22 V; IREG = 10 mA 6 V VP 22 V; IREG = 50 mA Regulator output: pin REG VREG output voltage 8 V VP 22 V; IREG = 0.5 mA 0.5 mA IREG 100 mA 6 V VP 45 V; IREG = 0.5 mA VREG(drop) VREG(stab) VREG(line) VREG(load) SVRR dropout voltage output voltage long-term stability line input regulation voltage load output regulation voltage supply voltage ripple rejection output current limit output leakage current at reverse polarity VP = 3.1 V; Tamb 85 C; IREG = 50 mA per 1000 h 7 V VP 22 V; IREG = 0.5 mA 7 V VP 45 V; IREG = 0.5 mA 0.5 mA IREG 50 mA fi = 120 Hz; Vi(ripple) = 1 V (RMS); IREG = 0.5 mA VREG > 2.8 V VP = -15 V; VREG 0.3 V 3.16 3.13 3.13 50 3.3 3.3 3.3 0.18 20 1 1 10 60 3.44 3.47 3.47 0.3 30 50 50 V V V V mV mV mV mV dB
[1]
Min 3 -
Typ 14.4 10 15 0.2 1.4
Max 45 30 0.5 2.5
Unit V A A mA mA
Supply voltage: pin VP
IREG(crl) ILO(rp)
0.17 -
0.25 1
500
A A
[1]
The regulator output will follow VP if VP < VREG + VREG(drop).
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Product data sheet
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
11. Application information
11.1 Noise
The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of 10 Hz to 100 kHz (see Table 7).
Table 7: Noise figures Noise figure (V) C2 = 10 F 0.5 50 550 650 C2 = 47 F 320 400 C2 = 100 F 300 400
Output current IREG (mA)
11.2 Stability
For stable operation:
* The output capacitor ESR should not exceed 22 (worst-case) * A minimum ESR may be required; see Table 8 * It is recommended not to use below 1 mA output current because of reduced phase
margin
* Use electrolytic capacitors for output capacity values of 1 F and above
Table 8: IREG (mA) 1 5 10 100 Minimum ESR values required C2 = 100 nF >0 >0 >0 >0 C2 = 1 F > 1.5 >0 >0 >0 C2 = 10 F >0 >0 >0 >0 C2 = 100 F >0 >0 >0 >0
11.3 Application circuits
The maximum output current of the regulator equals: 150 - T amb 150 - T amb I REG ( max ) = --------------------------------------------------------- = --------------------------------------- ( mA ) 100 x ( V P - 3.3 ) R th ( j - a ) x ( V P - V REG ) When Tamb = 21 C and VP = 14 V the maximum output current equals 116 mA. The total thermal resistance of the TDA3663 can be decreased from 155 K/W to 30 K/W for the SO8 version. For the SO4 version it can be decreased from 100 K/W to 25 K/W when GND pins 2 and 4 of the package are soldered to the printed-circuit board.
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Product data sheet
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
11.3.1 Application circuit with backup function
Sometimes a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even -1 V). This function can easily be built with the TDA3663 by using an output capacitor with a large value. When the supply voltage is 0 V (or -1 V), only a small current will flow into pin REG from this output capacitor (a few A). The application circuit is given in Figure 4.
VP
C1(1) 1 F
1
3
VREG = 3.3 V
C2(2)
TDA3663
2, 4
mgs587
(1) C1 is optional (to minimize supply noise only). (2) C2 4700 F.
Fig 4. Application circuit with backup function (SO4 version)
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
11.4 Additional application information
This section gives typical curves for various parameters measured on the TDA3663AT. Standard test conditions are: VP = 14.4 V; Tamb = 25 C.
mda947
25 Iq (A) 20
4 Iq (mA) 3
mda949
15 2 10
5
1
0 0 10 20 VP (V) 30
0 0 10 20 30 40 VP (V) 50
IREG = 0 mA.
Fig 5. Quiescent current as a function of the supply voltage
mda948
Fig 6. Quiescent current increase as a function of the high supply voltage
mda950
0.48 Iq (mA)
2 Iq (mA)
0.44
1.8
0.40
1.6
0.36 5 10 15 20 VP (V) 25
1.4 5 10 15 20 VP (V) 25
IREG = 10 mA.
IREG = 50 mA.
Fig 7. Quiescent current as a function of the supply voltage
Fig 8. Quiescent current as a function of the supply voltage
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Product data sheet
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
2 Iq (mA) 1.5
(1)
mda951
4 Iq (mA) 3
mda952
1
2
0.5
(2)
1
0 -40
0
40
80
120
160 Tj (C)
0 0 20 40 60 80 100 IREG (mA)
(1) Iq at 50 mA load. (2) Iq at 10 mA load.
Fig 9. Quiescent current as a function of the junction temperature
mgs695
Fig 10. Quiescent current as a function of the output current
mda957
4 VREG (V) 3
500
VREG(drop) (mV) 400
2
300
1
200
0 -50
0
50
100
150
200 Tj (C)
100 0 40 80 IREG (mA) 120
IREG = 0 mA.
Fig 11. Output voltage thermal protection as a function of the junction temperature
Fig 12. Dropout voltage as a function of the output current
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
4 VREG (V) 3
mgs696
-30 SVRR (dB) -40
mda956
(1)
(2)
2
-50
(3) (1)
1
-60
(2)
0 0 100 200 IREG (mA) 300
-70 10
(3)
102
103
104
f (Hz)
105
VP = 8 V and pulsed load.
IREG = 10 mA; C2 = 10 F. (1) SVRR at RL = 100 . (2) SVRR at RL = 500 . (3) SVRR at RL = 10 k.
Fig 13. Fold back protection mode
Fig 14. Supply voltage ripple rejection as a function of the ripple frequency
12. Test information
12.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
12.2 Test circuit
VP
C1(1) 1 F
1
3
VREG = 3.3 V
C2 10 F
TDA3663
2, 4
mgs586
(1) C1 is optional (to minimize supply noise only).
Fig 15. Test circuit (SO4)
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
13. Package outline
SO4: plastic small outline package; 4 leads; body width 3.5 mm SOT223-1
D
E
A
X
c y
HE b1
vMA
4
Q A A2 A1 (A3)
1
Z e e1
2
bp
3
wM detail X
Lp L
0
2 scale
4 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.8 A1 0.10 0.02 A2 1.7 1.5 A3 0.25 bp 0.85 0.65 b1 3.15 2.95 c 0.35 0.25 D
(1)
E
(1)
e 2.3
e1 4.6
HE 7.3 6.7
L 1.75
Lp 1.02 0.62
Q 1.0 0.8
v 0.2
w 0.1
y 0.1
Z 1.2 0.7
10 0
6.7 6.3
3.7 3.3
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT223-1 REFERENCES IEC JEDEC TO-261 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-15 03-02-19
Fig 16. Package outline SOT223-1 (SO4)
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8o o 0
ISSUE DATE 99-12-27 03-02-18
Fig 17. Package outline SOT96-1 (SO8)
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Product data sheet
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 9: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
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Product data sheet
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
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TDA3663
Very low dropout voltage/quiescent current 3.3 V voltage regulator
15. Revision history
Table 10: Revision history Release date 20050613 Data sheet status Product data Change notice Doc. number 9397 750 15047 Supersedes TDA3663_4 Document ID TDA3663_5 Modifications:
* * * * * * *
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Section 1 "General description": Removed automotive reference Section 2 "Features": Removed stability capacitor values and pin compatible products Section 3 "Quick reference data": Added VP = 3.1 V to the VREG(drop) conditions Section 7 "Functional description": Removed automotive reference and details on stability capacitors Section 11.2 "Stability": Removed two figures and examples; added a new stability description Section 11.4 "Additional application information": Changed Figure 13 and removed former Figure 14 Product specification 9397 750 07864 9397 750 07555 9397 750 06798 9397 750 06068 TDA3663_3 TDA3663_2 TDA3663_1 Preliminary specification Preliminary specification Preliminary specification -
TDA3663_4 TDA3663_3 TDA3663_2 TDA3663_1
20001214 20001208 20000201 19990929
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Very low dropout voltage/quiescent current 3.3 V voltage regulator
16. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Trademarks
Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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Very low dropout voltage/quiescent current 3.3 V voltage regulator
21. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 11.1 11.2 11.3 11.3.1 11.4 12 12.1 12.2 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application circuits . . . . . . . . . . . . . . . . . . . . . . 5 Application circuit with backup function . . . . . . 6 Additional application information . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13 Package related soldering information . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information . . . . . . . . . . . . . . . . . . . . 16
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 13 June 2005 Document number: 9397 750 15047
Published in The Netherlands

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